KA007AB
KA007 thermally conductive room temperature curing adhesive, designed to bond electronic components to heat sinks with a controllable gap. Low shrinkage and excellent thermal conductivity. It can quickly bond to most metals, ceramics, and glass without surface treatment. Excellent shear strength and good impact resistance and durability.
feature of product
樹脂規格
Hardening conditions
成品性質
1. This product has good operability after mixing.
2. It can be cured at room temperature or heated at 60°C / 30 min).
3. After the product is mixed, it has good fluidity and workability, and the surface gloss after hardening is good.
4. Zero solvent formula, low odor characteristics, fully comply with environmental protection requirements
5. Thermal conductivity is 0.8 W/mK.
6. Has excellent chemical resistance and water resistance.
7. This product complies with 2011/65/EU RoHS regulations.