JD628-3
JD628-3 is one component epoxy adhesive electronic devices dam. Cured product has low shrinkage. This resin can be fast cured at high temperature, is able to reduce the working time and increase the efficiency at the same time. This product develops tough, strong, structural bonds which provide excellent shear, peel and impact strength. The durability of this resin is very high levels and this resin can pass many environmental test experiments.
Features
Typical Uncured Properties
Typical Curing Properties
Typical Cured Properties*¹
1. This product is solvent-free, non-volatile, system and has no volative materials and will not release any toxic volatilizations.
2. The hardening surface will not exhibit a surface oiliness.
3. This product has low shrinkage.
4. The reactivity of this product is good at the temperature higher than 150oC.
5. Cured product is effective against moisture and water.
6. This product complies to the 2011/65/EU RoHS regulations.
7. This product complies to chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm.