JD551-8
JD551-8 is one component epoxy adhesive for electronic devices bonding. This resin can be fast cure at low temperature and is stable for dispensing. After curing, this product exhibits good adhesion strength and is suitable for different kinds materials bonding, it is especially good for plastics bonding. The durability of this product is very high levels and this resin is able to pass many environmental test experiments. This product is well suited for heat sensitive components bonding, Memory cards and C-MOS assembling.
Features
Resin specifications
Typical Curing Properties
Typical Cured Properties*¹
- This product is solvent-free and non-volatile system.
- The hardening surface will not exhibit a surface oiliness. Cured product has poor gloss.
- This resin offers excellent retention of electrical insulation properties under high humidity conditions.
- This resin offers excellent chemical resistance and solvent resistance.
- It is highly vibrate-resist at ordinary temperature.
- This product complies to the 2011/ 65/EU RoHS regulations.
- This product complies to chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm.
B. Color 1 (resin): black