JD541-2
JD541-2 is a single-component epoxy resin adhesive developed for the bonding of electronic components. This product is a single-component epoxy resin suitable for curing between 120 and 180°C. The resin has good adhesion and high Tg after hardening, and has good resistance to grease, chemicals and solvents. This product is a high-temperature hardening resin, suitable for bonding between various materials. This resin has excellent durability, has passed many different environmental tests, and is suitable for bonding electronic components.
Features
Typical Uncured Properties
Typical Curing Properties
Typical Cured Properties
1. This product is solvent-free and non-volatile system.
2. The hardening surface will not exhibit a surface oiliness.
3. This resin exhibits high viscosity and excellent thixotropy. This product can be also controlled flow and have sag resistance.
4. This product offers excellent chemical resistance and solvent resistance.
5. Cured resin is highly vibrate-resist at ordinary temperature.
6. This product complies to the 2011/65/EU RoHS regulations.