JD506-3
JD506-3 is a one component epoxy for electronic devices dipping. This resin develop good thermal shock and fatigue resistance. It is also used for electronic devices bonding. This product is recommnded as a high performance adhesive where reliability and durability is desired.
Features
Typical Uncured Properties
Typical Curing Properties
Typical Cured Properties *¹
- This resin exhibits low viscosity and excellent processing properties. It is easy to flow into the gaps of metal when using.
- The reactivity of this product is good at the temperature higher than 120oC.
- Cured resin forms an outstanding bonding with various substrates.
- The retained strength of this product after environmental test experiments is excellent.
- Cured resin exhibits excellent protection and electrical insulating properties.
- This product complies to the 2011/65/EU RoHS regulations.
B. Color 1 (resin): black