JC914-5
This product is a one component epoxy adhesive for electronic devices bonding. This product is easy to operate and suited for various applications of electronic components, such as casting and sealing. This resin can be fast cured at high temperature, is able to reduce the working time and increase the efficiency at the same time. This product develops tough, strong, structural bonds which provide excellent shear, peel and impact strength. The durability of this resin is very high levels and this resin can pass many environmental test experiments. When underfilling CSP and BGA chips, it can buffer the expansion and contraction stress of the solder ball contacts, and can buffer the shear force conducted by the reaction force during the drop test.
Features
Typical Uncured Properties
Typical Curing Properties
Typical Cured Properties*¹
1. This product is solvent-free, non-volatile, system and has no volative materials and will not release any toxic volatilizations.
2. This resin is low viscosity, excellent fluidity and easy to operate.
3. The hardening surface will not exhibit a surface oiliness and poor gloss at 80 °C. It will exhibit matte at 70 °C.
4. This resin has high fatigue and crack resistance.
5. This product complies to the 2011/65/EU RoHS regulations.
6. This product complies to chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm。