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- One-component Epoxy Resin (Thermal Curing)
- Two-Component Epoxy Resin (AB mix)
- UV Adhesive (UV light curing)
- Modified Silicone (Moisture Curing)
- Special Silicone (moisture curing)
- Special silicone (AB mix)
- UV PSA (UV light curing)
- Acrylic Adhesive (AB Mix)
- Thermally Conductive Material
- Bonding Fixation
- Coating
- Coating and Potting
- Component reinforcement
- Encapsulate protection
- Encapsulation sealing
- High Performance
- One component deacidification
- One component deoxime
- Removable/Tear by hand
- Two component addition
- Two component condensation
- ABS
- Acrylate
- Al
- Alloy
- AS
- BGA
- Carbon Fiber
- Ceramic
- Crystal
- CSP
- Cu
- Dam
- Epoxy
- Fe
- Fill
- FPC
- FRP
- Glass
- Glass Fiber
- HDPE
- LCP
- LDPE
- Low-κ dielectric
- Magnet
- MCM
- Metal
- Nickel Plated
- PA
- PA6
- PBT
- PC
- PCB-FR4
- PE
- PET
- Plastic
- PMMA
- PP
- PS
- PTFE
- PVA
- PVC
- Rubber
- Silicon
- Silicone Steel Plate
- Soft Plastic
- SS
- SUS
- Ti
- TPO
- TPU
- UHMWPE
- Wafer
- Wood
- 1. Low viscosity (>1k)
- 2. Low to medium viscosity (1k~50k)
- 3. Medium viscosity (50k~100k)
- 4. Medium to high viscosity (100k~150k)
- 5. High viscosity (>150000)
- Shore 00 (>50)
- Shore A (<50)
- Shore A (>50)
- Shore D (<50)
- Shore D (>50)
- Low halogen
- UL94-V0
- Tin free
- RoHS

Note: We are still updating the translation of documents in the English version.

If you can't find the product or the TDS/SDS file you need, please contact us.

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