Author: Cheng Yuhsiang
According to technology development, we will move from 4G era to 5G era to increase information transmission speed. It does not only make the processor become faster but also more heat generated. At this time, how to transfer the heat energy away is a big issue. If there is no good heat dissipation system, not long the processor will show up the problem. Currently, most of the heat dissipation system has material to release the heat, such as heat pipe, cooling fan, heat sink, thermal conductive adhesive, etc.
At present, 5G products in the market primarily focus on the smartphone. Before 5G smartphone becomes popular: the public telephone stations, small base stations, and servers need to set up the composition in advance. In the future, 5G products may also be transferred to automotive electronics, laptops, and home electronics applications, so as long as there are 5G products, certainly the thermally conductive materials are also required.
Due to the thermally conductive adhesive is one of the heat dissipation system materials, Everwide is also actively developing the thermally conductive adhesive to solve the heat dissipation problem. At present, we have successfully developed a low-viscosity, flame-retardant moisture-cured thermally conductive adhesive FS168W60, it has a thermal conductivity at 1.7W/m·K which can effectively support heat dissipation, only a viscosity of 60,000 cps can make customers have an excellent operation (Figure1) with UL 94 V-0 flame retardant effect to prevent continuous burning of materials (Figure 2). Although many fillers are added to the formula, the overall characteristics are still very flexible (Figure 3), which affects buffering stress. FS168W60 has good adhesion to general-purpose metals (Figure 4), and can be used on metal heat dissipation components.
In addition, FS168W60 is a one-component adhesive (Figure5). It does not need to be mixed before use. The curing principle is to use moisture in the air to cure the adhesive, so it can avoid the purchase of additional hardening equipment or avoid heating and curing causes damage to other parts.
We are currently actively developing the adhesive with thermal conductivity of 2~3W/m·K to solve customers' requirements. You are welcome to contact us.
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