Aug 7, 20233 minEverwide Newsletter No.407Experiment report § Low temperature foam material with high magnification With net-zero carbon emissions worldwide, implementing carbon...
Aug 7, 20233 minDual Liquid Modified Silicone Gel Encapsulation Adhesive Dual Liquid Modified Silicone Gel Encapsulation Adhesive Author: Lin Zhe Yong Varieties of one component moisture-curing products (RTV1)...
Jul 24, 20233 minEverwide newsletter No.406Experiment § High heat resistance glass fiber prepreg resin The continuous phase of composite materials is often a polymer. In addition...
Jul 10, 20233 minEverwide newsletter No.405Experiment § Two-component 1:1 low surface energy heterogeneous adhesive In 2020, we developed two-component 10:1, room temperature...
Jun 26, 20233 minEverwide newsletter No.404Experiment § Dam & Fill Dam & Fill is a liquid barrier material used for component encapsulation, which first uses Dam to form a barrier...