Aug 29, 20114 minEverwide Newsletter-No.99Experiment § Molded transformer resin The insulating material of the molded transformer is epoxy resin, and its hardener is divided into...
Aug 15, 20114 minEverwide newsletter No.98Experiment § The problem of warpage of plastic board Recently, when we studied the large area of epoxy resin coated on the plastic board...
Aug 1, 20114 minEverwide newsletter No.97Experiment § PET packaging box In a society where 3C products are the mainstream, product packaging is also a science. How to highlight...
Jul 18, 20114 minEverwide newsletter No.96Experiment § Improvement of the moisture-curing process Generally, the humidity of moisture-curing resin is recommended to be below 55%,...
Jul 4, 20114 minEverwide newsletter No.95Experiment § The mystery of flashpoint The general method of measuring the flashpoint of a chemical substance is to place the substance...
Jun 20, 20114 minEverwide newsletter No.94Experiment § Discussion of AG (anti-glare) affect Everwide newly developed anti-glare film, commonly known as AG film, is a protective...
Jun 7, 20113 minEverwide newsletter No.93Experiment § The optoelectronic component is cracked A customer found that some photoelectric components filled with epoxy resin will...
May 23, 20115 minEverwide newsletter No.92Experiment § Some variables that affect the two-component adhesive Many epoxy resin adhesives provide a variety of curing conditions for...
May 9, 20113 minEverwide newsletter No.91Experiment § Chip-on-Glass COG (Chip-On-Glass) is an advanced packaging technology that interconnects IC and substrate. This technology...