Thermal analysis
熱分析
熱分析
Thermal analysis
物質在溫控條件下, 發生的物理或化學變化與溫度之關係。
The relationship between the physical or chemical changes of a substance in relation to temperature under temperature controlled conditions.
Application: Measure the thermal conductivity of resin at room temperature. Measure the thermal resistance of resin at room temperature.
Application: Measure the output of heat, response rate and calculate the reaction kinetic parameters of the resin. Measure the thermal properties such as specific heat and glass transition temperature of the cured resin. Model: TA Instruments, Inc. DSC Q20
Application: Measure the glass transition temperature and thermal expansion coefficient of the cured resin. It can change the dimension into reversible and irreversible reactions. Measure the flexural modulus and loss modulus at various frequencies of the cured resin. Measure viscoelastic properties such as creep and stress relaxation of the cured resin. Model: TA Instruments, Inc. TMA Q400
Application: Measure the heat resistance, degradation temperature and calculate the cracking kinetic parameters of the cured resin. Measure the resin filler content and coking coal ratio after resin cracking. Model: TA Instruments, Inc. TGA Q50
用途： 測量樹脂的在室溫下的熱傳導係數。 測量樹脂的在室溫下的熱阻抗係數。 機型： America Anter Corporation QL-10(3)A
用途: 測量樹脂的反應放熱量、反應率、計算樹脂的反應動力學參數。 測量樹脂硬化後的比熱、玻璃轉移溫度等各項熱性質。 機型Model: TA Instruments, Inc. DSC Q20
用途: 測量樹脂硬化後的玻璃轉移溫度與熱膨脹係數，能夠將尺寸變化分解成可逆反應與不可逆反應測量樹脂硬化後各種頻率下的彈性模數、損耗模數。測量樹脂硬化後的潛變、應力弛緩等黏彈性質。 機型Model: TA Instruments, Inc. TMA Q400
用途： 測量樹脂硬化後的耐熱性、裂解起始溫度、計算樹脂的裂解動力學參數。 測量樹脂的填充物含量、樹脂裂解後的焦炭率。 機型： TA Instruments, Inc. TGA Q50