Epoxy Resin

Encapsulation-IC
Principle
For insulation epoxy of BGA, bonding with player of CSP, and Flip-Chip, it needs to bond effectively and does not to generate stress to pass rigorous test.

Application
BGA,CSP,Flip-Chip under fill, Edge reinforcement, Corner bonding.

One
No.
Substrate
Charactristic
Color
Viscosity
Pot
Curing
Tg
CTE
H
%
ohm-cm
D
Storage
JC738-10
BGA
Low viscosity
Black
300
25゚C
3~5days
130゚C
10min
85
58
D84
0.4
4.5*1014
3.2
-40゚~
120゚
-40゚~-20゚ 6Months
JC823-3
BGA
Low viscosity
Black
700
25゚C
5~7days
80゚C
30min
28
60
A77
2.4
4.5*1014
3:2
-40゚~
120゚
-40゚~-20゚ 8Months
JC823-6
BGA
Low temperature curing
Black
3000
25゚C
2days
80゚C
30min
100゚C
15min
50
38
D80
2.4
4.5*1014
3.2
-40゚~
120゚
-40゚~-20゚ 8Months
JC914-3
BGA
Medium temperature curing
Black
1800
25゚C
7days
120゚C
5min
80゚C
30min
95
46
D87
0.17
6.0*1013
3:3
-40゚~
120゚
-40゚~-20゚ 8Months
JD100
CSP
Low thermal expansion
Black
30000
25゚C
3~5days
150゚C
40min
90
31
D88
0.2
4.5*1014
3.2
-40゚~
150゚
-40゚
8Months
JD100-1
CSP
Low thermal expansion
Black
9800
25゚C
3~5days
150゚C
20min
124
32
D90
0.1
4.5*1014
3:2
-40゚~
150゚
-40゚
8Months
JC817-2
MCM,Fill
Low shrinkage
Black
30000
25゚C
2days
120゚C
60min
64
226
D69
0.97
5*1014
4.37
-40゚~
150゚
-20゚~-5゚ 6Months
JC817-3
MCM,Dam
Low shrinkage
Black
335000
25゚C
2days
120゚C
60min
20
48
D65
1.77
5*1015
4.1
-40゚~
150゚
-20゚~-5゚ 6Months

Two
No.
Substrate
Charactristic
Color
Mix
A
B
Pot
Curing
Tg
CTE
Hardness
kv/mm
Storage
JC056AB
BGA
High toughness, Impact resistance
A:White B:Yellow
2:1
30000~
60000
12000~
18000
25゚C
20min
25゚C
2hr
25゚C
5~7days
80゚C
1hr
73
115
D84
22
-40゚~
120゚
14゚~34゚ 1year

*Please see more information in Technical Data Sheet.

Encapsulation-FR4、FPC
Principle
It is easy for epoxy resin to bond insulating epoxy coating layer, such applications focus on the performance of the physical properties of the adhesive.

Application
COB, E-paper, E-book, SMT application.

One
No.
Substrate
Charactristic
Color
Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
%
ohm-cm
Dielectric Constant
Storage
JC349-8
FR4
High Thixotropic Index
Black
190000
25゚C
7days
120゚C
40min
131
47
D90
0.59
4.5*1014
3.2
-40゚~
120゚
0゚~10゚
1year
JC349-10
FR4
Low shrinkage
Black
80763
25゚C
7days
120゚C
40min
128
40
D89
0.23
4.5*1014
3:2
-40゚~
120゚
0゚~10゚
1year
JC437
FPC
Good resistance to moisture penetration
Yellow
780~
1200
25゚C
3days
80゚C
30min
37
63
D80
1.23
4.5*1014
3.2
-40゚~
120゚
-40゚~-20゚ 8Months
JC485-3
FPC
Good resistance to moisture penetration
Yellow
42000~
52000
25゚C
3days
70゚C
40min
44
106
A82
1.34
4.5*1014
3:2
-40゚~
120゚
-40゚~-20゚ 8Months
JC900-1
FPC
Good penetration
White
300~500
25゚C
5~7days
80゚C
30min
12
18
A77
2.4
4.5*1014
3.2
-40゚~
120゚
-40゚~-5゚ 8Months
JC900-3
FPC
Good penetration
Black
550~850
25゚C
5~7days
80゚C
30min
28
60
A77
2.4
4.5*1014
3:2
-40゚~
120゚
-40゚~-5゚ 8Months
JC812-2
FR4 for SMT
High Thixotropic Index, High-speed dispensing
Red
190000~
300000
25゚C
2days
90゚C
3min
28
63
D73
0.38
4.5*1014
3.2
-40゚~
120゚
-40゚~-5゚ 8Months
JB511-24
FR4 for SMT
High Thixotropic Index, High-speed dispensing
Red
36000~
54000
25゚C
5~7days
100゚C
10min
88
53
D84
0.89
4.5*1014
3.2
-40゚~
120゚
-40゚~-5゚ 8Months

Two
No.
Substrate
Charactristic
Color
Mix ratio
A Viscosity
B Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
kv/mm
Storage
JC337-8AB
FR4
Can be resistant to 270゚C
A:Gray B:Gray
2:1
180000~
280000
300000~
460000
25゚C
20min
25゚C
2hr
25゚C
5~7days
80゚C
1hr
166
42
D90
20
-40゚~
120゚
0゚~10゚
6Months

*Please see more information in Technical Data Sheet.

Encapsulation-Electronic Parts
Principle
Our adhesives can for various viscosity, materials, and all kinds of requirements, the most important is it can be lead-free and pass welding high temperature.

Application
Relays, Switches, Inductors, Ignition coil.

One
No.
Substrate
Charactristic
Color
Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
%
ohm-cm
Dielectric Constant
Storage
JC564-34
Plastic
High temperature resistance
Black
25000~
60000
25゚C
1~2days
100゚C
13min
100゚C
60min
140
73
D88
0.07
4.5*1014
4
-20゚~
120゚
-40゚~-5゚ 8Months
JD095-10
Plastic
High temperature resistance
Black
30000~
47000
25゚C
1~2days
120゚C
5min
120゚C
40min
127
55
D87
0.48
4.5*1014
4
-20゚~
120゚
-40゚~-5゚ 8Months

Two
No.
Substrate
Charactristic
Color
Mix ratio
A Viscosity
B Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
kv/mm
Storage
JA813-9AB
Plastic
Low shrinkage, Good flowability
A:Black B:Yellow
100:50
2000~
4000
1000~
2000
25゚C
1hr
25゚C
8hr
25゚C
5~7days
35
85
D77
18
-20゚~
120゚
14゚~34゚ 1year
NC489AB
Highly crystalline plastics
Thermal shock resistance
A:Orange B:Yellowish
3:1
6000±
1000
60±20
25゚C
1hr
25゚C
24hr
110゚C
90min
50~
70
67
D85
18
-20゚~
120゚
14゚~34゚ 1year

*Please see more information in Technical Data Sheet.

Encapsulation-Inorganic Material
Principle
The best way to bond Inorganic materials is to add filler to joint with the holes of the substrate.

Application
CGS, Tantalum capacitors, The projector optical channel, Ceramic oscillator.

One
No.
Substrate
Charactristic
Color
Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
%
ohm-cm
Dielectric Constant
Storage
JC315-3
Ceramic,Metal
High temperature resistance
Gray
140000~
220000
25゚C
7days
25゚C
7days
150゚C
30min
125
59
D84
0.3
4.5*1014
4.1
-20゚~
120゚
-40゚~-5゚ 8Months
JC747-6
Ceramic,Glass Fiber
Low shrinkage
Yellow
124000~
186000
25゚C
5~7days
130゚C
1hr
150゚C
30min
116
120
D85
0.9
4.3*1014
4.3
-20゚~
120゚
-40゚~-5゚ 8Months

Two
No.
Substrate
Charactristic
Color
Mix ratio
A Viscosity
B Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
kv/mm
Storage
JC455-6AB
Ceramic,Metal
UL class Good we ather resistance
A:Transparent
B:Yellowish
5:1
83000~
130000
<100
25゚C
2hr
25゚C
4hr
80゚C
4hr
43
45
D77
18
-20゚~
120゚
14゚~34゚ 1year

*Please see more information in Technical Data Sheet.

IATF 16949:2016

ISO 9001:2015

ISO 14001:2015

 

OHSAS 18001:2007