Epoxy Resin

Casting-FR4、FPC
Principle
Special formula adhesive could have excellent adhesion with epoxy on PCB or insulating inks.

Application
LED Strip, LED module with aluminum case casting.

One
No.
Substrate
Charactristic
Color
Viscosity
Pot
Curing
Tg
CTE
H
%
ohm-cm
D
゚C
Storage
JB988-4
FR4
High bonding strength
Black
290000
25゚C
3days
120゚C
60min
33
204
D78
0.6
5*1014
4.1
-20゚~
120゚
0゚~10゚
6Months

Two
No.
Substrate
Charactristic
Color
Mix
A
B
Pot
Curing
Tg
CTE
H
kv/mm
゚C
Storage
JB646-2AB
FPC
Very soft
A:White B:Yellow
1:1
12000~
16000
50~80
25゚C
12~24hr
50゚C
9hr
80゚C
3hr
-5
245
A59
19
-20゚~
120゚
14゚~34゚ 1year
JD052AB
FR4
Low shrinkage
A:
Transparent
B:
Transparent
4:1
900~
1500
<100
25゚C
2~3hr
25゚C
4hr
25゚C
5~7days
80゚C
1hr
31
70
D71
20
-20゚~
120゚
14゚~34゚ 1year

*Please see more information in Technical Data Sheet.

Casting-ABS、PC、PA
Principle
The most important thing to cast the plastic shell is not to damage the plastic substrate.
So that the characteristics of the plastic substrate will not changed, and have a good environmental test results.

Application
LED car lights, Fire sensors, Relays, Switch.

One
No.
Substrate
Charactristic
Color
Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
%
ohm-cm
Dielectric Constant
Storage
JC589-1
ABS,PC
High temperature resistance
Black
11300
25゚C
5days
120゚C
30min
124
49
D87
0.56
4.5*1014
3.2
-20゚~
100゚
0゚~10゚ 1year

Two
No.
Substrate
Charactristic
Color
Mix ratio
A Viscosity
B Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
kv/mm
Storage
JA293-2AB
ABS,PC
Thermal conductivity, Low shrinkage
A:
Black
B:
Transparent
100.8
40000~
50000
50~100
25゚C
6hr
25゚C
24hr
25゚C
5~7days
25
1.78
D76
20
-20゚~
100゚
14゚~34゚ 1year
JA331-AB
ABS,PC
Not to hurt the substrate
A:
Transparent
B:
Yellow
2:1
4400~
6600
300~500
25゚C
30min
25゚C
3~4hr
25゚C
5~7days
40
295
D65~70
20
-20゚~
100゚
14゚~34゚ 6Months
0゚~10゚ 1year
JA350-2AB
ABS,PC
Impact resistance
A:White B:Yellow
2:1
10000~
18000
15000~
22000
25゚C
3g 30min
25゚C
3g 4~5hr
25゚C
5~7days
80
45
D75
20
-20゚~
100゚
14゚~34゚ 1year

*Please see more information in Technical Data Sheet.

Casting-Metal
Principle
In order to maintain extending elastic property when facing thermal expansion, so adopting the semi-soft chemical structure to bond metal.

Application
Fiber optic connectors, Motorcycle battery module, Metal micro-device.

One
No.
Substrate
Charactristic
Color
Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
%
ohm-cm
Dielectric Constant
Storage
JB558-1
Ceramic,Metal
Good penetration
Brown
90
25゚C
6months
150゚C
8~12min
150゚C
30min
65
74
D86
1.1
5*1014
4.1
-20゚~
120゚
0゚~10゚ 1year

Two
No.
Substrate
Charactristic
Color
Mix ratio
A Viscosity
B Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
kv/mm
Storage
JA723AB
Metal,Glass
Low shrinkage, UL class
A:Black B:Brown
4:1
16000~
22000
200~500
25゚C
1hr
25゚C
1hr
25゚C
5~7days
40
51.7
D78
20
-20゚~
120゚
14゚~34゚ 1year

*Please see more information in Technical Data Sheet.

Casting-Inorganic Material Ceramic
Principle
The best way to bond inorganic materials is to add filler to joint with the holes of the substrate.

Application
COB process, Waterproof connectors, High voltage controller.

One
No.
Substrate
Charactristic
Color
Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
%
ohm-cm
Dielectric Constant
Storage
JC349-10
FR4,Metal
Non flowing
Black
80763
25゚C
7days
120゚C
40min
128
40
D89
0.23
4.5*1014
3.2
-20゚~
120゚
0゚~10゚ 1year

Two
No.
Substrate
Charactristic
Color
Mix ratio
A Viscosity
B Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
kv/mm
Storage
JA940-5AB
Metal,Plastic,Ceramic
UL class
A:Black B:Yellow
2:1
14000~
22000
20000~
30000
25゚C
1~2hr
25゚C
8hr
25゚C
5~7days
80゚C
1hr
55
49
D85
20
-20゚~
120゚
14゚~34゚ 1year

*Please see more information in Technical Data Sheet.

IATF 16949:2016

ISO 9001:2015

ISO 14001:2015

 

OHSAS 18001:2007