Epoxy Resin

Bonding-Metal+Thermosetting Plastic
Principle
It can release the thermal expansion and contraction of pulling force for heterogeneous materials.

Application
Transformer、Optical fiber connector.

One
No.
Substrate
Charactristic
Color
Viscosity
Pot
Curing
Tg
CTE
H
%
ohm-cm
D
゚C
Storage
JC180-3
PC,AL
Thermal shock resistance
White
162000
25゚C
3days
70゚C
60min
80゚C
40min
80
30
D85
0.03
4.5*1014
3.2
-20゚~
100゚
-20゚~-5゚ 8months
JC750
LCP,PC,AL
Low temperature curing
Black
30000~
50000
25゚C
7days
70゚C
45min
80゚C
30min
30
47
D77
0.43
5*1014
4.1
-20゚~
100゚
-40゚~-20゚ 8months
JB542
SS,PC
High toughness
White
60000
25゚C
7days
100゚C
60min
120゚C
40min
31
229
D75
1.1
4.5*1014
3.2
-30゚~
100゚
0゚~10゚
1year
JC315-3
PET,AL
High temperature resistance
Gray
140000~
220000
25゚C
7days
150゚C
30min
125
59
D84
0.3
4.7*1014
3.3
-30゚~
150゚
0゚~10゚ 8months

Two
No.
Substrate
Charactristic
Color
Mix
A
B
Pot
Curing
Tg
CTE
H
kv/mm
Storage
JA484-3
FE,PC
Rapid curing
A:
Transparent
B:
Yellowish
1:1
15000~
23000
9000~
15000
25゚C
3min
25゚C
13min
25゚C
3days
52
218
D84
19
-20゚~
100゚
14゚~34゚ 1year
JC056-1
AL,Epoxy
High toughness impact resistance
A:Black B:Yellow
2:1
30000~
60000
20000~
36000
25゚C
20min
25゚C
2hr
25゚C
5~7days
73
115
D84
20
-20゚~
120゚
14゚~34゚ 1year

*Please see more information in Technical Data Sheet.

Bonding-Metal+Thermoplastic
Principle
Soft type adhesive could have exothermic reaction to invade plastic lightly to achieve good adhesion.

Application
LED Light bar, Micro-Motors

One
No.
Substrate
Charactristic
Color
Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
%
ohm-cm
Dielectric Constant
Storage
JD148-4
AL,PVC
Rapid curing
White
15800
25゚C
1days
80゚C
5~10min
27
180
D83
0.41
4.5*1014
4.1
-20゚~
100゚
-40゚~-20゚ 8Months
JB988-4
AI,ABS
Thermal expansion and contraction resistance
Black
290000
25゚C
3days
120゚C
60min
33
204
D78
0.6
5*1014
4.1
-20゚~
100゚
0゚~-10゚ 6Months

Two
No.
Substrate
Charactristic
Color
Mix ratio
A Viscosity
B Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
kv/mm
Storage
JC666AB
Nylon,SS
High impact resistance
A:White B:Black
1:1
40000~
60000
58000~
90000
25゚C
30min
25゚C
6~7hr
25゚C
5~7days
46
29
D71
19
-20゚~
100゚
14゚~34゚ 1year
JC466-6AB
PC,SS
Soft and resistant to bend
A:Yellow B:Gray
1:1
150000~
240000
300000~
500000
25゚C
2hr
25゚C
6~7hr
25゚C
5~7days
30
103
D75
20
-20゚~
100゚
14゚~34゚ 6Months
0゚~10゚
1year

*Please see more information in Technical Data Sheet.

Bonding-Metal+Glass、Ceramic
Principle
The CTE of the cured adhesive is very close to the inorganic material by adding large amount of inorganic powder.

Application
Pressure sensor, Temperature sensors, LED bulb.

One
No.
Substrate
Charactristic
Color
Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
%
ohm-cm
Dielectric Constant
Storage
JC531-3
Glass,AL,PBT
High impact resistance
White
220000
25゚C
3days
80゚C
30min
100
45
D90
0.33
4.5*1014
3.2
-20゚~
100゚
-40゚~-20゚ 8Months
JB418
Cu,AL,Glass
High temperature resistance, High bonding strength
Yellow
150000~
250000
25゚C
24hr
150゚C
60min
<30
80
D30
<0.5
4*1014
3.1
-30゚~
150゚
-20゚~-5゚ 6Months
JC531-5
SS,Ceramic
High temperature resistance, High bonding strength
White
50000
25゚C
7days
120゚C
60min
150゚C
30min
111
47
D86
0.41
4.5*1014
3.2
-30゚~
150゚
-20゚~-5゚ 8Months

Two
No.
Substrate
Charactristic
Color
Mix ratio
A Viscosity
B Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
kv/mm
Storage
JB553AB
SS, Ceramic
High bonding strength
A:White B:Yellow
2:1
17000~
39000
16000~
36000
25゚C
30min
25゚C
4hr
25゚C
5~7days
55
34
D75
19
-20゚~
100゚
14゚~34゚ 1year
JB925-12AB
AL,Glass
High impact resistance
A:White B:Yellow
2:1
35000~
55000
130000~
210000
25゚C
20min
25゚C
2hr
25゚C
5~7days
12
28
D84
20
-20゚~
100゚
14゚~34゚ 1year

*Please see more information in Technical Data Sheet.

Bonding-Metal+Carbon fiber、Glass fiber
Principle
To enhance the impact resistance by adding special rubber and polyurethane so the adhesive is able to bond with fiber products.

Application
Bicycle, carbon fiber composite materials, sports equipment.

One
No.
Substrate
Charactristic
Color
Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
%
ohm-cm
Dielectric Constant
Storage
JC750
AL,LCP
Low temperature curing
Black
30000~
50000
25゚C
7days
70゚C
45min
80゚C
30min
30
47
D77
0.43
5*1014
4.1
-20゚~
100゚
-40゚~-20゚ 8Months
JC747
AL,Carbon fiber
Impact resistance, Non-flowing
Gray
400000~
600000
25゚C
5~7days
150゚C
30min
117
117
D81
0.43
4.2*1014
3.6
-30゚~
150゚
0゚~10゚ 8Months
JC315-3
SS,Magnet
High bonding strength, Impact resistance
Gray
140000~
220000
25゚C
7days
25゚C
7days
150゚C
30min
125
59
D84
0.3
4.3*1014
3.8
-30゚~
150゚
0゚~10゚
8Months

Two
No.
Substrate
Charactristic
Color
Mix ratio
A Viscosity
B Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
kv/mm
Storage
JD040AB
AL,PCB
Low temperature curing, Low odor
A:
Transparent B:
Transparent
1:1
9600~
14400
8300~
13000
25゚C
3min
25゚C
10min
25゚C
3days
57
61
D80
22
-20゚~
100゚
14゚~34゚ 1year
JC258-1AB
AL,Carbon fiber
High bonding strength, Impact resistance
A:Black B:Yellow
2:1
22000~
34000
16200~
19800
25゚C
20~30min
25゚C
7hr
25゚C
5~7days
60
96
D76
22
-20゚~
100゚
14゚~34゚ 1year

*Please see more information in Technical Data Sheet.

Bonding-Metal+Metal
Principle
Adding a large number of inorganic powders, aluminum powder to increase adhesion property.

Application
Cooling module, Electric motor

One
No.
Substrate
Charactristic
Color
Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
%
ohm-cm
Dielectric Constant
Storage
JC822
SS,AL
Non-flowing, Low temperature curing
Gray
52100
25゚C
5~7days
80゚C
20min
28
42
D80
0.29
4.5*1014
3.2
-20゚~
100゚
-40゚~-20゚ 8Months
JB688-25
SS,AL
High thermal conductivity, Non-flowing
Gray
490000~
750000
25゚C
5~24hr
150゚C
30min
65
13
D92
0.04
4.5*1014
3.4
-20゚~
120゚
-20゚~-5゚ 8Months
JB913-2
Titanium,
Cu
High toughness, High temperature resistance
Yellow
62500~
94000
25゚C
7days
135゚C
60min
62
196
D85
0.4
4.5*1014
3.3
-20゚~
150゚
-20゚~-5゚ 8Months
JB940
FE,Magnet
High toughness, High temperature resistance
Gray
60000~
110000
25゚C
7days
150゚C
30min
99
71
D82
0.3
4.5*1014
3.4
-20゚~
200゚
0゚~10゚ 8Months

Two
No.
Substrate
Charactristic
Color
Mix ratio
A Viscosity
B Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
kv/mm
Storage
JB373-6AB
SS,AL
High transparency, Anti-yellowing
A:
Transparent B:
Yellowish
2:1
6400~
9600
3200~
4800
25゚C
20~30min
25゚C
1~1.5hr
25゚C
5~7days
55
59
D81
22
-20゚~
120゚
14゚~34゚ 1year
JB735AB
SS,AL
Non-flowing, High toughness
A:Gray B:Gray
2:1
120000~
240000
17000~
27000
25゚C
10min
25゚C
1~1.5hr
25゚C
3~5days
54
33
D87
22
-20゚~
120゚
14゚~34゚ 1year

*Please see more information in Technical Data Sheet.

Bonding-Thermosetting Plastic+Thermoplastic
Principle
In advantage to the temperature of the adhesive reaction to swell the surface of the substrate, so that the resin can adhere sufficiently.

Application
Electronic wallet packaging, Cooling fan, Waterproof connectors, Printed Circuit Board repair, optical lens.

One
No.
Substrate
Charactristic
Color
Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
%
ohm-cm
Dielectric Constant
Storage
JC823-22
PCB,PC,PET
Low temperature curing
Black
19000
25゚C
2days
75゚C
30min
100゚C
15min
31
80
D80
2.4
4.5*1014
3.2
-20゚~
100゚
-40゚~-20゚ 8Months
JC342-5
PCB,PC,PET
High bonding strength, Non-flowing
Blue-
Green
8000~
12000
25゚C
7days
135゚C
60min
97
108
D82
0.31
9.24*1011
4.1
-20゚~
150゚
-40゚~-5゚ 8Months

Two
No.
Substrate
Charactristic
Color
Mix ratio
A Viscosity
B Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
kv/mm
Storage
JC600AB
PVC,PC
Rapid curing, toughness
Transparent
1:1
1000~
5000
8000~
16000
25゚C
5min
25゚C
10min
25゚C
3days
14
80
D43
19
-20゚~
100゚
14゚~34゚ 1year
JC466-6AB
PVC,PC,PET
soft hardness and bendable
A:Yellow B:Gray
1:1
150000~
240000
300000~
500000
25゚C
2hr
25゚C
1hr
25゚C
5~7days
30
103
D75
20
-20゚~
100゚
14゚~34゚ 1year

*Please see more information in Technical Data Sheet.

Bonding-Thermosetting Plastic+Glass、Ceramic
Principle
Using the tenacity feature to ease the shear strength of thermal expansion between different materials, so it can achieve effective bonding.

Application
Optical senser module, LED bulb, Transformer, Relays, Inductor.

One
No.
Substrate
Charactristic
Color
Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
%
ohm-cm
Dielectric Constant
Storage
JC750
LCP,Glass
Low temperature curing
Black
30000~
50000
25゚C
7days
70゚C
45min
80゚C
30min
30
47
D77
0.43
5*1014
4.1
-20゚~
100゚
-40゚~-20゚ 8Months
JC180-3
PC,Glass,Ceramic
High impact resistance
White
162000
25゚C
3days
70゚C
60min
80゚C
30min
80
30
D85
0.03
4.5*1014
3.2
-20゚~
100゚
-20゚~-5゚ 8Months

Two
No.
Substrate
Charactristic
Color
Mix ratio
A Viscosity
B Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
kv/mm
Storage
JB925-4AB
Glass,Nylon
High impact resistance
A:Black B:Yellow
2:1
17000~
26000
20000~
36000
25゚C
20min
25゚C
2hr
25゚C
5~7days
73
115
D84
19
-20゚~
100゚
14゚~34゚ 1year
JC249-20AB
Silicone
rubber,PC
High toughness, Impact resistance
A:Black B:Yellow
2:1
800~
1200
450~
750
25゚C
30min
25゚C
30min
25゚C
3~4days
80゚C
60min
32
65
D79
20
-20゚~
100゚
14゚~34゚ 1year

*Please see more information in Technical Data Sheet.

Bonding-Thermoplastic+Glass、Ceramic
Principle
It can swell the surface of substrate by the thermal temperature of adhesive exothermic reaction and has sufficient adhesion.

Application
E-books, Cooling fan, Micro-motors, Reversing radar.

One
No.
Substrate
Charactristic
Color
Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
%
ohm-cm
Dielectric Constant
Storage
JC202-4
Glass,PI
Good resistance to moisture penetration
Yellow
48000~
52000
25゚C
24hr
80゚C
1hr
63
64.9
D78
0.17
4.5*1014
4
-40゚~
100゚
-40゚~-20゚ 8Months

Two
No.
Substrate
Charactristic
Color
Mix ratio
A Viscosity
B Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
kv/mm
Storage
JC667AB
PVC,Ceramic
High toughness
A:
Transparent
B:
Black
1:1
6000~
14000
20000~
39000
25゚C
30min
25゚C
6~8hr
25゚C
5days
63
40
D70
18
-40゚~
120゚
14゚~34゚ 1year
JB007AB
Metal,Ceramic,PVC
Good resistance to moisture solvent
A:Black B:Brown
2:1
110000~
140000
6000~
12000
25゚C
30min
25゚C
6~8hr
25゚C
5days
60
45
D83
21
-40゚~
100゚
14゚~34゚ 1year

*Please see more information in Technical Data Sheet.

Bonding-Glass、Ceramic+Carbon Fiber、Glass Fiber
Principle
Adding a large amount of powder to increase adhesion with inorganic material and also to reduce the coefficient of thermal expansion and shrinkage.

Application
Medical needles, Electric cars, Bicycles.

One
No.
Substrate
Charactristic
Color
Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
%
ohm-cm
Dielectric Constant
Storage
JC822-22
Carbon fiber,Metal
Low temperature curing
White
11593
25゚C
3days
90゚C
30min
18
44
D63
2.22
4.5*1014
4.1
-40゚~
100゚
-40゚~-20゚ 8Months
JC315-3
Ceramic,Silicon steel,Glass fiber
High temperature resistance
Gray
140000~
220000
25゚C
7days
25゚C
7days
150゚C
30min
125
59
D84
0.3
4.3*1014
4.3
-40゚~
100゚
0゚~10゚ 8Months

Two
No.
Substrate
Charactristic
Color
Mix ratio
A Viscosity
B Viscosity
Pot Life
Curing Condition
Tg
CTE
Hardness
kv/mm
Storage
JA577AB
Carbon fiber,Ceramic
High impact resistance
A:White B:Yellow
2:1
13000~
19000
12000~
18000
25゚C
30min
25゚C
4hr
25゚C
7days
48~52
20
D82
19
-20゚~
120゚
14゚~34゚ 1year
JD002AB
Carbon fiber,Ceramic
Slow curing 120min
A:White B:Yellow
2:1
31000~
47000
14000~
23000
25゚C
30min
25゚C
90min
25゚C
5~7days
71
76
D81
18
-20゚~
120゚
14゚~34゚ 1year

*Please see more information in Technical Data Sheet.

IATF 16949:2016

ISO 9001:2015

ISO 14001:2015

 

OHSAS 18001:2007